| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and device for cutting a non-metallic substrate utilizing a laser beam. <P>SOLUTION: After an initial crack is formed, a cutting surface 110 is formed at the non-metallic substrate 100 by propagating the initial crack and thereafter the continuous formation of the crack to be intersected with the cutting surface without stopping a cutting process is made possible. As a result, diversified effects can be exhibited in suppressing chipping, minimizing cutting defects, increasing a process progressing speed, minimizing the occurrence frequencies of process defects, etc. <P>COPYRIGHT: (C)2003,JPO</p> |
