| 摘要 |
An IC package feeder is constructed to include a platform, a vibrator controlled to oscillate the platform, a material delivery tube path unit formed of fixed rails and movable rails respectively mounted on the platform at the top near a rear side and defining a plurality of pitch-adjustable parallel material delivery tube passages, an IC package path unit formed of fixed rod members and movable rod members respectively mounted on the platform at a top near a front side and defining a plurality of pitch-adjustable IC package passages respectively aligned in line with the material delivery tube passages, the IC package passages each having a tapered rear side expanding backwards, and a cover vertically adjustably mounted on the platform and covering over the rod members of the IC package path unit, the cover having sloping guide means disposed corresponding to the tapered rear sides of the IC package passages and adapted to guide IC packages from the material delivery tube path unit to the IC package passages.
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