发明名称 STICTION ALLEVIATION USING PASSIVATION LAYER PATTERNING
摘要 The present invention alleviates stiction between a suspended beam (25) or microstructure and an underlying substrate (15) by providing a patterned passivation layer (20) on the substrate underneath the beam. The passivation layer is patterned to provide a substrate surface that differs substantially from the bottom surface (27) of the beam. The difference between these two surfaces reduces the potential contact area between the beam and the substrate when the beam is pulled down, thereby reducing adhesive forces between the beam and the substrate and reducing the likelihood of stiction. In one embodiment, the passivation layer is patterned to form a substrate surface comprising a plurality of protuberances (40).
申请公布号 WO03067662(A1) 申请公布日期 2003.08.14
申请号 WO2003US02578 申请日期 2003.01.29
申请人 SUPERCONDUCTOR TECHNOLOGIES, INC.;PROPHET, ERIC, M. 发明人 PROPHET, ERIC, M.
分类号 B81B3/00;H01L21/334;(IPC1-7):H01L27/108;H01L29/82;H01L21/00;H01L21/824;H01L21/20;G01D15/00;B41J2/04;B41J2/06 主分类号 B81B3/00
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