SEMICONDUCTOR CHIP MOUNTING BOARD, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR MODULE

摘要

A semiconductor chip mounting board 2 comprises a first conductive bump for mounting a semiconductor chip 3 formed on one face side of an insulating resin base 5, a wiring pattern 15 extended from the first conductive bump toward the periphery of the insulating resin base 5, a filling via hole reaching the wiring pattern 15 from the other face of the insulating resin base 5, and a second conductive bump or a conductor pad 19 located just above the filling via hole and electrically connected. The semiconductor chip 3 is mounted on the semiconductor chip mounting board 2, and the mounting boards and interlayer members 20 are stacked alternately via an adhesive. Another connecting circuit board such as an I/O wiring board 30 is disposed on the outermost layer. The laminate is integrated by heat press to manufacture a semiconductor module excellent in connection reliability and capable of being thinned down with an increase in component density.