| 摘要 |
A method for manufacturing a double-sided circuit board (10) from a board material (1) having a first electric conductor layer (11) and a first electrically insulating layer (12), including the steps of: making conduction holes (13) in the board material (1) so as to penetrate only the first electrically insulating layer (12) or both the first electrically insulating layer (12) and the first electric conductor layer (11); forming an electrically conductive thin-film layer (14) on a surface of the first electrically insulating layer (12) and wall surfaces of the conduction holes (13); forming a second electrically insulating layer (15) on the electrically conductive thin-film layer (14); forming a first electric conductor wiring (16) by electroplating on predetermined portions of the electrically conductive thin-film layer (14); covering the first electric conductor wiring (16) with a chemical-resistant film (17); forming a second electric conductor wiring (18) by chemically dissolving a predetermined portion of another surface of the first electric conductor layer (11); and removing the second electrically insulating layer (15) and the film (17). <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE> |
