CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A chemical mechanical polishing apparatus is provided to be easily adapted to each semiconductor process by including a plurality of loading devices so that an additional constitution becomes unnecessary regarding various processes. CONSTITUTION: A plurality of platens(32) have each polishing surface. A plurality of carrier heads pressurize the polishing surface of a wafer to polish the wafer, maintaining the wafer to polish. A plurality of loading devices include a wafer maintaining portion positioned in a predetermined circumference with respect to the rotation center of the loading device, disposed in a position accessible to the carrier head. The loading devices can rotate and increase the wafer placed on the loading devices. A cleaning unit(40) cleans the polished wafer. The wafer before a polishing process or the wafer after the polishing process is received in a plurality of wafer cassette units(10). The first transfer apparatus(11) transfers the wafer received in the wafer cassette unit and waiting for being polished or the wafer cleaned in the cleaning unit. The second transfer apparatus(16) transfers the wafer prior to the polishing process to the loading device and transfers the wafer placed on the loading device to the cleaning unit after the polishing process. The wafer is temporarily received in an intermediate standby unit(15) between the first and second transfer apparatuses.