发明名称 Anode assembly and method of reducing sludge formation during electroplating
摘要 A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.
申请公布号 US2003150715(A1) 申请公布日期 2003.08.14
申请号 US20020039275 申请日期 2002.01.04
申请人 YAHALOM JOSEPH;STAROSVETSKY DAVID;HAZAN JOSEPH 发明人 YAHALOM JOSEPH;STAROSVETSKY DAVID;HAZAN JOSEPH
分类号 C25D7/12;C25D17/10;C25D21/18;(IPC1-7):C25D3/00 主分类号 C25D7/12
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