发明名称 Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same
摘要 A bottom track pole is formed on a surface of a bottom pole, a thin film coil is formed on the bottom pole to form a flat coplanar surface with the bottom track pole, a write gap film is formed on the flat coplanar surface, first and second magnetic material films constituting a top pole are formed on a flat surface of the thin film coil, and the second magnetic material film, first magnetic material film, write gap film and bottom track pole are partially removed by RIE to form a top track pole and trim structure in a self-aligned manner. The thin film coil is formed by a first thin film coil half and a second thin film coil half having coil windings which are formed in a self-aligned manner between successive coil windings of the first thin film coil half and have a two-layer structure of a first conductive film at least a part of which is formed by CVD and a second conductive film formed by electrolytic plating. A thin insulating film is interposed between successive coil windings of the first and second thin film coil halves. Jumper wirings for connecting an innermost coil winding of the first thin film coil half to an outermost coil winding of the second thin film coil half are formed together with the top pole.
申请公布号 US2003151849(A1) 申请公布日期 2003.08.14
申请号 US20020067863 申请日期 2002.02.08
申请人 发明人 SASAKI YOSHITAKA;KAMIGAMA TAKEHIRO
分类号 G11B5/17;G11B5/31;G11B5/39;H01F17/00;H01F41/04;(IPC1-7):G11B5/17 主分类号 G11B5/17
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