| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated ceramic electronic components wherein thickness of a dielectric material layer is reduced by realizing a thin internal electrode layer. SOLUTION: An internal electrode paste layer is formed on a carrier, the internal electrode paste layer is compressed under the condition that a protection film is laminated to cover the internal electrode paste layer, thereafter the protection film is peeled off and a dielectric material green sheet layer is formed covering the internal electrode paste layer to form a unit laminated layer where the internal electrode paste layer and dielectric material green sheet layer are laminated. Thereafter, a green chip body where a predetermined number of the unit laminated layers are laminated and baked. COPYRIGHT: (C)2003,JPO
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