发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To form a conductive film of which the interface is stable and not resistive in the double-layer film structure of polysilicon film/silicide film. SOLUTION: In a method for manufacturing a semiconductor device, when forming a conductive film, a nonuniform natural oxide film 7 on a silicon film 3 is removed first, and a thin film of an uniform clean silicon oxide film 4 is then formed through oxidizing chemical treatment, and after that a silicide film 5 is formed. This allows the stable conductive film 6 having a double- layered structure of polysilicon film 3/silicide film 5 to be formed.
申请公布号 JPH11238697(A) 申请公布日期 1999.08.31
申请号 JP19980040551 申请日期 1998.02.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 OMORI TOSHIAKI
分类号 H01L21/28;H01L21/285;H01L21/321;H01L21/768;H01L23/485;H01L29/45;H01L29/49;H01L29/78;(IPC1-7):H01L21/28 主分类号 H01L21/28
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