| 摘要 |
PROBLEM TO BE SOLVED: To flatten unevenness of a surface of a wafer which is just cut off. SOLUTION: A column composed of silicon Si or germanium Ge is cut thinly by a blade, and a wafer is formed. Temperature of the wafer is increased up to the melting point of the wafer by heating with a heating wire or fuel, and the unevenness of the wafer which is just cut off is made flat. COPYRIGHT: (C)2003,JPO
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