发明名称 Heat exchanger having a manifold plate structure
摘要 The invention relates to a heat exchanger having a manifold plate structure. The heat exchanger comprises a first and a second manifold plate. The first and second manifold plates allow a refrigerant communication between an outside of the heat exchanger and another plate. The manifold plates together form a closed flat tube and each of the manifold plates has a pair of cup portions. The first manifold plate has a first slot and the second manifold plate has a second slot. The edge of the first slot has a projected burr portion. The first slot is configured for insertion into a slot of a first adjacent plate that is configured to be connected to the first manifold plate. The length and width of the first slot are less than the length and width of the second slot.
申请公布号 US2003145981(A1) 申请公布日期 2003.08.07
申请号 US20020330467 申请日期 2002.12.26
申请人 HARK SHIN SEUNG;HO KIM YONG 发明人 HARK SHIN SEUNG;HO KIM YONG
分类号 F28D1/03;F28F3/04;F28F9/04;(IPC1-7):F28D1/02;F28F9/02 主分类号 F28D1/03
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