| 摘要 |
PURPOSE: A clamping apparatus for semiconductor fabrication equipment is provided to lengthen the lifetime of a bellows by performing accurately the up and down operation of a clamp and preventing the vibration due to the abrasion. CONSTITUTION: A clamping apparatus(130) for semiconductor fabrication equipment includes a clamp ring, a shaft(134), a driving portion, a bellows, and a guide portion(139). The shaft is installed vertically to the clamp ring in order to be moved to an upper portion or a lower portion. The driving portion moves the shaft to the upper portion or the lower portion. The bellows is connected to the shaft in order to intercept the inflow of air from the outside. The guide portion is installed at the bellows in order to guide the movement of the shaft.
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