发明名称 EPOXY RESIN COMPOSITION, PREPREG AND LAMINATED BOARD
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a cured product with excellent flame retardance even if no halogen compound is contained and with excellent in moisture absorption and adhesiveness, to provide a prepreg using the epoxy resin composition and a laminated board using the prepreg. SOLUTION: The epoxy resin composition comprises a phosphor-containing epoxy resin, an aromatic diamine and a solvent, wherein the phosphor-containing epoxy resin is obtained by modifying an epoxy resin with the phosphor compound (9,10-dihydro-9-oxa-10-phosphophenanthrene-10-oxide) represented by formula (1) and the aromatic diamine is a compound including 3-6 benzene rings in the molecule. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003221430(A) 申请公布日期 2003.08.05
申请号 JP20020024503 申请日期 2002.01.31
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ISHIDA TAKEHIRO;YONEMOTO KAMIO;FUJIKI TOMOYUKI
分类号 C08J5/24;C08G59/14;C08G59/20;C08G59/50;(IPC1-7):C08G59/20 主分类号 C08J5/24
代理机构 代理人
主权项
地址