发明名称 |
EPOXY RESIN COMPOSITION, PREPREG AND LAMINATED BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a cured product with excellent flame retardance even if no halogen compound is contained and with excellent in moisture absorption and adhesiveness, to provide a prepreg using the epoxy resin composition and a laminated board using the prepreg. SOLUTION: The epoxy resin composition comprises a phosphor-containing epoxy resin, an aromatic diamine and a solvent, wherein the phosphor-containing epoxy resin is obtained by modifying an epoxy resin with the phosphor compound (9,10-dihydro-9-oxa-10-phosphophenanthrene-10-oxide) represented by formula (1) and the aromatic diamine is a compound including 3-6 benzene rings in the molecule. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003221430(A) |
申请公布日期 |
2003.08.05 |
申请号 |
JP20020024503 |
申请日期 |
2002.01.31 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
ISHIDA TAKEHIRO;YONEMOTO KAMIO;FUJIKI TOMOYUKI |
分类号 |
C08J5/24;C08G59/14;C08G59/20;C08G59/50;(IPC1-7):C08G59/20 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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