METHOD AND APPARATUS FOR CONTROLLING DIE ATTACH FILLET HEIGHT TO REDUCE DIE SHEAR STRESS

摘要

A method and an apparatus for preventing cracking and delamination in a packaged semiconductor chip by controlling the die attach fillet 30 height Z. Specifically, the present invention controls the die attach material20 height, thereby controlling the die attach fillet 30 height Z, and thereby reducing shear stress in the die 5 itself. Advantages of the present invention include increasing wire-bond reliability and package reliability without the need for requalification of existing products. By using currently qualified molding compounds and die attach epoxies in conjunction with the present technique for controlling the die attach epoxy height in order to control the die attach fillet 30 height Z, the overall assembly process may be maintained. Thus, neither thermal performance nor electrical performance is compromised.