Verbindungsprüfung unter Verwendung von Leiterplatten-Topologiedaten

摘要

A method for generating improved detection and diagnostic test patterns and for improving the diagnostic resolution of interconnect testing of a circuit is based on the premise that short-circuits are most likely to result from solder bridges between closely adjacent pins. In a first embodiment, an optimal boundary-scan test pattern is generated. In a second embodiment, boundary-scan test diagnosis is enhanced. In a third embodiment, diagnosis of unpowered short-circuit testing is enhanced.