发明名称 HIGH FREQUENCY MODULE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To reduce a deterioration of a characteristic and variation of each of conductive portions caused from fiberglass of a substrate material, keep high performance and high accuracy, and improve reliability. <P>SOLUTION: A module 1 is equipped with a base substrate 2 in which wiring layers 14-17 are multi-layered on organic substrates 11, 12 and at least the upper most layer is flattened and is composed as a build-up surface, and is equipped with an element-formed part 3 in which wiring layers 27, 29, 32 and a plurality of conductive portions 19, 20 forming a passive element and a distribution constant element, etc., transmitting a high frequency signal are formed. Each of the conductive portions 19, 20, 32 of the element-formed portion 3 is formed corresponding to non-existing areas of glass textile of the organic substrate 11 of the base substrate 2. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003218272(A) 申请公布日期 2003.07.31
申请号 JP20020017620 申请日期 2002.01.25
申请人 SONY CORP 发明人 OKUHORA AKIHIKO
分类号 H01L23/12;H01L23/14;H01L23/498;H01L23/66;H01P1/00;H05K1/02;H05K1/03;H05K1/16;H05K3/46 主分类号 H01L23/12
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