| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor chip by preventing deterioration of mounting accuracy caused by sticking of dust or the like, during mounting in processing of a semiconductor wafer. SOLUTION: An adhesive sheet for wafer sticking consists of a first base material, a first adhesive layer formed on the first base material, a second base material formed on the first adhesive layer and a second adhesive layer formed on the second base material, chemical reaction where adhesion of the first adhesive layer lowers and chemical reaction wherein adhesion of the second adhesion layer lowers differ. COPYRIGHT: (C)2003,JPO |
