| 发明名称 |
SEMICONDUCTOR DIE PACKAGE WITH SEMICONDUCTOR DIE HAVING SIDE ELECTRICAL CONNECTION |
| 摘要 |
<p>A semiconductor die package is disclosed. In one embodiment, the semiconductor die package includes a circuit substrate including a conductive region. A semiconductor die is on the circuit substrate. The semiconductor die includes an edge and a recess at the edge. A solder joint couples the semiconductor die and the conductive region through the recess.</p> |
| 申请公布号 |
WO03063248(A1) |
申请公布日期 |
2003.07.31 |
| 申请号 |
WO2003US02070 |
申请日期 |
2003.01.21 |
| 申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION;ESTACIO, MARIA, CRISTINA, B. |
发明人 |
ESTACIO, MARIA, CRISTINA, B. |
| 分类号 |
H01L23/12;H01L21/301;H01L21/768;H01L23/48;H01L23/485;H01L23/498;(IPC1-7):H01L27/10;H01L27/15;H01L23/52 |
主分类号 |
H01L23/12 |
| 代理机构 |
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