| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor device on a printed board with facing-down in a semiconductor device and its manufacturing method, and a manufacturing apparatus, and ensure an improvement of the reliability of a connection portion and the facilitation of an exchange of the semiconductor device. SOLUTION: There are provided a semiconductor device 12 having an electrode 14, and a metal bump 16 composed of a gold containing solder film 52 disposed on the electrode of the semiconductor device and a metal bump element 56 disposed on the gold containing solder film. The metal bump 16 is mounted on the electrode of the semiconductor device. COPYRIGHT: (C)2003,JPO
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