| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric component which can securely prevent a dielectric substrate from thermally damaging during soldering. SOLUTION: A piezoelectric substrate 12 has vibration electrode films 141 and 142 on both its surfaces and also has its one surface bonded to one surface of a base substrate 11 across a vibration space with an adhesive 15. The dielectric substrate 13 is bonded to the other surface side of the piezoelectric substrate 12 across a vibration space with an adhesive 16. Terminal electrode films 21 to 23 are stuck on at least flanks of the base substrate 11, piezoelectric substrate 12, and dielectric substrate 13. A solder nonsticking film 3 is a film where no solder sticks and stuck on a region for preventing solder from sticking on terminal electrode films 21 to 23 stuck on the flanks of the piezoelectric substrate 12 and dielectric substrate 13 on at least the terminal electrode films 21 to 23. COPYRIGHT: (C)2003,JPO
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