| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which is reduced in thickness without decreasing its semiconductor light emitting element in size and its manufacturing method. <P>SOLUTION: A countersink 5a where a semiconductor light emitting element 4 is inserted is bored in a holding board 8, a plurality of composite light emitting devices 1 each composed of the semiconductor light emitting element 4 and a sub-mount element 3 mounted with the element 4 are mounted on the holding board 8 so as to make the semiconductor light emitting elements 4 disposed inside the countersinks 5a respectively, the countersink 5a is filled up with transparent resin 6, the resin 6 is cured, then the holding board 8 is diced into the separate composite light emitting devices 1, and the cut surface of the composite light emitting device 1 is made to serve as a main light extracting plane. In a semiconductor light emitting device as mentioned above, the main light extracting plane of the composite light emitting device 1 faces in the direction perpendicular to the mounting surface of the sub-mount element 3 of the semiconductor light emitting device 1 or the main light emitting plane of the semiconductor light emitting element 4, so that the semiconductor light emitting device 1 which is reduced in thickness independently of the size of the main light emitting plane of the semiconductor light emitting element 4 can be realized. <P>COPYRIGHT: (C)2003,JPO |
