CHEMICAL MECHANICAL POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE AND AQUEOUS DISPERSING FLUID FOR CHEMICAL MECHANICAL POLISHING,申请号KR20030004696-传众专利搜索

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发明名称	CHEMICAL MECHANICAL POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE AND AQUEOUS DISPERSING FLUID FOR CHEMICAL MECHANICAL POLISHING
摘要
申请公布号	KR20030064326(A)	申请公布日期	2003.07.31
申请号	KR20030004696	申请日期	2003.01.24
申请人		发明人
分类号	H01L21/304;B24B37/00;C09G1/02;C09K3/14;H01L21/321	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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