发明名称 |
SEALING BOARD, MANUFACTURING METHOD FOR IT, DISPLAY DEVICE AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To reduce the weight of a sealing board without shortage of strength and any increase in quantity of transmitting moisture and oxygen. SOLUTION: This sealing board has a base plate 10 where a recess 12 is formed and a covering layer 20 formed at the base of the recess 12. The covering layer 20 is formed thinner than the depth of the recess 12 and formed of a material having a smaller specific gravity than that of the base plate 10. The base of the recess 12 is a rough surface, and the covering layer 20 is formed in close contact with the base. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003217828(A) |
申请公布日期 |
2003.07.31 |
申请号 |
JP20020012885 |
申请日期 |
2002.01.22 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HAYASHI KENJI |
分类号 |
H05B33/04;H01L23/02;H01L51/50;H05B33/14;(IPC1-7):H05B33/04 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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