发明名称 SEALING BOARD, MANUFACTURING METHOD FOR IT, DISPLAY DEVICE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the weight of a sealing board without shortage of strength and any increase in quantity of transmitting moisture and oxygen. SOLUTION: This sealing board has a base plate 10 where a recess 12 is formed and a covering layer 20 formed at the base of the recess 12. The covering layer 20 is formed thinner than the depth of the recess 12 and formed of a material having a smaller specific gravity than that of the base plate 10. The base of the recess 12 is a rough surface, and the covering layer 20 is formed in close contact with the base. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003217828(A) 申请公布日期 2003.07.31
申请号 JP20020012885 申请日期 2002.01.22
申请人 SEIKO EPSON CORP 发明人 HAYASHI KENJI
分类号 H05B33/04;H01L23/02;H01L51/50;H05B33/14;(IPC1-7):H05B33/04 主分类号 H05B33/04
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