发明名称 HEAT-RESISTING FLAME-RETARDANT ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD AND THE FLEXIBLE PRINTED- WIRING BOARD GIVEN BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a heat-resisting flame-retardant adhesive composition for a flexible printed-wiring board, having flame retardancy, even though it contains no halogen, and having excellent resistance to heat aging, and to provide the flexible printed-wiring board given by using the composition. SOLUTION: The heat-resisting flame-retardant adhesive composition for the flexible printed-wiring board contains (A) a polysiloxaneimide and (B) a phosphorus-containing epoxy resin as main components and further contains (C) a hardener. The flexible printed-wiring board is given by using the composition. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003213241(A) 申请公布日期 2003.07.30
申请号 JP20020009018 申请日期 2002.01.17
申请人 TOKAI RUBBER IND LTD 发明人 MIHARA TOSHIYUKI;FUJIKAWA TOMOHIRO;SHIMIZU TAKAYUKI
分类号 C08L63/00;C08G59/20;C08L79/08;C09J163/00;C09J179/08;C09J183/08;H05K1/03;(IPC1-7):C09J183/08 主分类号 C08L63/00
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