发明名称 |
Interconnection arrangements for testing microelectronic circuit chips on a wafer |
摘要 |
A wafer having microelectronic circuit chips thereon having electrical connections between the chips arranged so that effectively the chips are on a surface which at least in one direction is unbounded. The electrical connections may be arranged so that the chips are effectively on the surface of a cylinder, or they may be effectively on a helix. The electrical connections may optionally be arranged so that the chips are effectively on a toroid, or on an endless helix. The output connections from a chip adjacent one edge of the wafer may be connected through electrical conductors direct to the input connections of a chip adjacent the opposite edge of the wafer.
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申请公布号 |
US4295182(A) |
申请公布日期 |
1981.10.13 |
申请号 |
US19800120035 |
申请日期 |
1980.02.11 |
申请人 |
THE SECRETARY OF STATE FOR INDUSTRY IN HER BRITANNIC MAJESTY'S GOVERNMENT OF THE UNITED KINGDOM OF GREAT BRITAIN AND NORTHERN IRELAND |
发明人 |
AUBUSSON, RUSSELL C.;GLEDHILL, RICHARD J. |
分类号 |
H01L21/822;G01R31/28;G11C29/00;H01L21/66;H01L21/82;H01L23/14;H01L23/538;H01L27/04;H01L27/118;(IPC1-7):H01L27/00 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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