| 摘要 |
PROBLEM TO BE SOLVED: To obtain a laminate for a printed wiring board, which has properties of applicability to a high-melting lead-free solder, low water absorption and high heat resistance, contains neither a halogen element nor an antimony compound and takes the environment into consideration. SOLUTION: This resin composition for a laminate comprises a resin component composed of (a) a compound containing a dihydrobenzoxazine ring in the molecule and (b) a compound containing a phenolic hydroxy group and an anthranilate group in the molecule as essential components and preferably at least one or more kinds of (c) an epoxy resin, (d) a condensed phosphoric acid ester and (e) an inorganic filler. The resin composition has≤0.25 wt.% halogen content and≤0.25 wt.% antimony content. This prepreg is obtained by impregnating the resin composition for a laminate as a varnish into a substrate and drying. This laminate for printed wiring board is heating and pressurizing the prepreg. COPYRIGHT: (C)2003,JPO
|
