| 摘要 |
A lead frame is fabricated by a stamping system, and the lead frame 1 having a predetermined pattern is fabricated by blanking a lead frame material by a progressive stamping die apparatus while the lead frame material is being consecutively transferred. A pressing force is applied to burrs occurring during the fabrication of the lead frame 1 so as to squeeze the burrs, thereby forming coined portions 6 and 7. Next, a coined groove 8 is formed horizontally on the surface of the lead frame 1 at a position slightly above a resin liquid level 4. Resin climbing 5 in which the resin rises from the liquid level due to a capillary phenomenon is stopped at the position of the coined groove 8 thus formed, thereby allowing soldering of the lead frame 1 to be effected without a hindrance.
|
