Isolation testing scheme for multi-die packages

摘要

A test platform is configured to test a mult-die package having at a first die and a second die. The test platform includes a first lead that is connected to the VCC input on the first die. The test platform also includes a second lead that is connected to VCCIO input on the second die. The VCC input on the second die is connected to ground. The I/O pin of the second die can then be tri-stated using a control circuit disposed between the pre-driver and the driver of the I/O buffer.