| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a creamy solder having high reliability in which high quality bump can be formed without producing void in the soldered bump, and a method for producing the creamy solder. <P>SOLUTION: In the creamy solder 17 for forming the solder bump to an objective with a solder printing method, this creamy solder is constituted of a solder material and a solvent having boiling point lower than the melting point of the solder material by ≥80°C. <P>COPYRIGHT: (C)2003,JPO |
