发明名称 CONDUCTIVE ONE LIQUID PHASE POLYURETHANE-BASED ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF
摘要 PURPOSE: A conductive one liquid phase polyurethane-based adhesive composition and its preparation method are provided, to enable the adhesive composition to be cured to show an excellent adhesive strength without additional curing accelerator, thereby reducing the working time and improving the convenience of construction. CONSTITUTION: The polyurethane-based adhesive composition comprises 100 parts by weight of a one liquid phase polyurethane adhesive composition comprising 20-40 wt% of a two functional polyether polyol with a number average molecular weight of 1,000-3,000, 15-20 wt% of a three functional polyether polyol with a number average molecular weight of 3,000-6,000, 10-13 wt% of toluene diisocyanate, 10-15 wt% of diphenylmethane diisocyanate, 0.5 wt% of a two functional glycol comprising 1,4-butanediol, 0.2-0.5 wt% of benzoyl chloride, 0.8-1.0 wt% of sodium silicoaluminate, 12-15 wt% of toluene, 11-14 wt% of ethyl acetate, and 0.5-1.0 wt% of methylethylketone; 5-15 parts by weight of a filler comprising clay; and 5-15 parts by weight of a conductive material comprising carbon black.
申请公布号 KR20030063246(A) 申请公布日期 2003.07.28
申请号 KR20030019651 申请日期 2003.03.28
申请人 HWA SUNG CO., LTD. 发明人 CHOI, HYEON SU;JANG, YEONG GYU
分类号 C09J175/04;(IPC1-7):C09J175/04 主分类号 C09J175/04
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