| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board in which a wiring circuit of a metal foil having a fine pattern can be inexpensively formed by a dry process. SOLUTION: The method for manufacturing the circuit board comprises the steps of forming a connecting electrode 12 for connecting a via on an insulation resin film 11, then disposing a metal foil 13a for forming a wiring circuit 13 on the resin film 11, aligning a pressing jig 14 having a protruding shape 14a simulating to the wiring pattern of the circuit 13 to be disposed on the foil 13a, and sandwiching the jig 14 between hot platens 15a and 15b. Thus, the foil 13a is punched according to a wiring pattern by the shaped pattern 14a of the jig 14, and hot pressed on an upper surface of the electrode 12 and the film 11 around the electrode 12. COPYRIGHT: (C)2003,JPO
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