| 摘要 |
PROBLEM TO BE SOLVED: To surely fill a conductive paste in a through hole and to shorten its required time. SOLUTION: The method for filling the conductive paste comprises the steps of disposing a board 1 in which through holes 1a are formed, at a position corresponding to the hole 1a to be brought into close contact with a space filling guide base 4 having an opening 4a, and heating the paste 3 filled in the hole 1a via the opening 4a. Thus, at the filling time, an escape route of gas existing in the hole 1a is assured to surely fill the paste 3. Since the filling, drying and curing are continuously conducted, a time required for a process is shortened. Further, the filled paste 3 is not adhered to the base 4, the board 1 can be easily separated, and can prevent a fault from occurring in the hole la. COPYRIGHT: (C)2003,JPO
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