ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION

摘要

A method is provided that comprises forming a copper seed layer (335) on a workpiece (300) and measuring the uniformity of the copper seed layer (335) on the workpiece (300). The method further comprises applying the uniformity measurement to modify processing to form a copper layer (425) having a desired uniformity profile for increased planarization in subsequent planarizing.