发明名称 |
Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features |
摘要 |
A method and system for fabricating micron and sub-micron-sized features within a polymer layer of a nascent semiconductor device or other micro-device or nano-device. Small features are directly imprinted with an optical-mechanical stamp having corresponding intrusions. Large features are created by exposing the surface of selected areas of the polymer surface to UV radiation by transmitting UV radiation through the optical-mechanical stamp to chemically alter the polymer, allowing either UV-exposed or UV-shielded areas to be removed by solvents. Thus, described embodiments of the present invention provide for a partially transparent imprinting mask that employs purely mechanical stamping for fine features and lithography-like chemical polymer removal for large features. |
申请公布号 |
US2003138704(A1) |
申请公布日期 |
2003.07.24 |
申请号 |
US20020058744 |
申请日期 |
2002.01.23 |
申请人 |
MEI PING;TAUSSIG CARL P.;JEANS ALBERT H. |
发明人 |
MEI PING;TAUSSIG CARL P.;JEANS ALBERT H. |
分类号 |
G03F1/08;G03F7/20;H01L21/027;H01L21/265;H01L21/336;H01L29/786;(IPC1-7):G03F7/20 |
主分类号 |
G03F1/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|