发明名称 |
TARGET/BACKING PLATE ASSEMBLIES |
摘要 |
The invention encompasses PVD target/backing plate assemblies which include a PVD target (30) having a surface, and a bonding layer (40) on the surface. The bonding layer has a different composition than the target surface, and a backing plate (46) is provided to be separated from the PVD target surface by at least the bonding layer. The bonding layer forms a strong diffusion bond to the target. The invention also include methods of forming PVD target/backing plate assemblies. Additionally, the invention includes assemblies in which one or more of titanium, zirconium, and copper is incorporated into a bonding layer between a target and a backing plate in a physical vapor deposition target/backing assembly. |
申请公布号 |
WO02061167(A3) |
申请公布日期 |
2003.07.24 |
申请号 |
WO2001US50345 |
申请日期 |
2001.10.19 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
KOHLER, RON, D.;COOPER, MATHEW, S. |
分类号 |
C23C14/34;H01J37/34;H01L21/285 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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