发明名称 TARGET/BACKING PLATE ASSEMBLIES
摘要 The invention encompasses PVD target/backing plate assemblies which include a PVD target (30) having a surface, and a bonding layer (40) on the surface. The bonding layer has a different composition than the target surface, and a backing plate (46) is provided to be separated from the PVD target surface by at least the bonding layer. The bonding layer forms a strong diffusion bond to the target. The invention also include methods of forming PVD target/backing plate assemblies. Additionally, the invention includes assemblies in which one or more of titanium, zirconium, and copper is incorporated into a bonding layer between a target and a backing plate in a physical vapor deposition target/backing assembly.
申请公布号 WO02061167(A3) 申请公布日期 2003.07.24
申请号 WO2001US50345 申请日期 2001.10.19
申请人 HONEYWELL INTERNATIONAL INC. 发明人 KOHLER, RON, D.;COOPER, MATHEW, S.
分类号 C23C14/34;H01J37/34;H01L21/285 主分类号 C23C14/34
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