发明名称 |
HEAT SINK HAVING HIGH EFFICIENCY COOLING CAPACITY AND SEMICONDUCTOR DEVICE COMPRISING IT |
摘要 |
A thin lightweight heat sink having high-efficiency cooling capacity which can deal with a high-heat-generation semiconductor device, and a semiconductor comprising the heat sink. The heat sink for semiconductor device comprises a base section having a first face arranged with a plurality of heat dissipation fins and a second face touching a semiconductor device directly, and a heat spreader arranged on the second face of the base section so as not to touch the semiconductor device directly. |
申请公布号 |
WO03061001(A1) |
申请公布日期 |
2003.07.24 |
申请号 |
WO2002JP00243 |
申请日期 |
2002.01.16 |
申请人 |
FUJITSU LIMITED;MIYAZAKI, RYUUJI;SUZUKI, MASUMI |
发明人 |
MIYAZAKI, RYUUJI;SUZUKI, MASUMI |
分类号 |
H01L23/367;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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