| 摘要 |
An adhesive sheet for affixation of a wafer includes a first substrate, first adhesive layer arranged on the first substrate, second substrate arranged on the first adhesive layer, and second adhesive layer arranged on the second substrate. A chemical reaction which causes reduction in the adhesion of the first adhesive layer and a chemical reaction which causes reduction in the adhesion of the second adhesive layer are different. A method for processing using this sheet includes the steps of affixing the sheet to a wafer, dicing the wafer with the sheet affixed thereto, peeling the first substrate and first adhesive layer away from the diced wafer by reducing the adhesion of the first adhesive layer and, thereby, dividing the wafer into a plurality of chips, and peeling the second substrate and second adhesive layer away from each of the chips by reducing the adhesion of the second adhesive layer.
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