发明名称 Heat pipe loop with pump assistance
摘要 A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.
申请公布号 US2003136555(A1) 申请公布日期 2003.07.24
申请号 US20030348816 申请日期 2003.01.22
申请人 DINH KHANH 发明人 DINH KHANH
分类号 F28D15/02;F28D15/06;(IPC1-7):F28D15/00;F28F27/00 主分类号 F28D15/02
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