| 摘要 |
<p>A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).</p> |
