| 摘要 |
Disclosed herein is a semiconductor device comprising a substrate having a first area on which a semiconductor element is mounted, a second area which surrounds the first area, and a third area located in a central portion of the first area; wirings extending from the second area to the third area and formed over the substrate; an insulting film which is formed in the first and second areas so as to expose the third area and covers the substrate and the wirings; and the semiconductor element which is electrically connected to the wirings within the third area and which has a size equal to the first area and is mounted on the first area so as to be spaced a predetermined interval from the insulating film.
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