发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED WIRING BOARDS
摘要 <p>A photosensitive resin composition comprising (A) a resin curable with actinic radiation, (B) a photopolymerization initiator, (C) a reactive diluent, and (D) an epoxy compound, wherein the resin (A) is composed of (a) a prepolymer produced by esterifying a novolak-type epoxy compound with an unsaturated carboxylic acid and reacting the resulting epoxy-esterification product with a saturated or unsaturated polybasic acid anhydride, (b) a prepolymer produced by esterifying a bisphenol-type epoxy compound with an unsaturated carboxylic acid and reacting the resulting epoxy-esterification product with a saturated or unsaturated polybasic acid anhydride, and (c) a prepolymer produced by reacting an unsaturated monobasic acid copolymer resin with an alicyclic epoxy-containing unsaturated compound.</p>
申请公布号 WO2003059975(P1) 申请公布日期 2003.07.24
申请号 JP2001011645 申请日期 2001.12.28
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