发明名称 Processor and power supply circuit
摘要 A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.
申请公布号 US6596948(B1) 申请公布日期 2003.07.22
申请号 US20000560794 申请日期 2000.04.28
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 HADEN STUART C.;HARRIS SHAUN L.;DAY MICHAEL C.;PALLOTTI LISA HEID
分类号 H05K3/46;H05K1/02;H05K1/11;(IPC1-7):H01R12/04 主分类号 H05K3/46
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