| 摘要 |
A heat sink assembly (10) for removing heat from multiple semiconductor devices (12, 14) is disclosed. A support plate (20) is positioned over the semiconductor devices (12, 14) to be cooled. Two threaded bores (22, 24) corresponding to the positioning and layout of the semiconductor devices (12, 14). The support plate (20) is secured relative to the semiconductor devices (12, 14). Heat dissipating members (26, 32) are threadably received in the bores (22, 24) to dissipate heat from the semiconductor devices (12, 14) simultaneously using a single, small footprint, heat sink assembly (10). |
