| 摘要 |
Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.
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