| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing of semiconductors which is free of halogen-type flame retarders and antimony compounds and has high moldability, high flame retardancy, good high-temperature storage characteristics and high soldering resistance. SOLUTION: The composition contains (A) an epoxy resin, (B) a phenol resin, (C) a hardening accelerator, (D) an inorganic filler and (E) aluminum hydroxide of formula (1): Al<SB>2</SB>O<SB>3</SB>(H<SB>2</SB>O)<SB>n</SB>(wherein n is larger than 2 and smaller than 3) having an average grain size of 0.01-14μm. COPYRIGHT: (C)2003,JPO
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