| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that is caused in terms of reliability of airtight sealing as the miniaturization and thinning of a container for housing an electronic component advance in the container for housing the electronic component composed of an insulation base body and a tabular lid body. <P>SOLUTION: The container for housing the electronic component is composed of the insulation base body 1 having a recessed part for loading the electronic component 3 on an upper surface and the lid body 2 joined to the upper surface of the insulation base body 1 through a glass sealing material 6 and airtightly housing the electronic component 3 in a space formed with the insulation base body 1. The lid body 2 has a slab shape having the thickness of 0.3 mm or less, the outer dimension of the lid body 2 is smaller than the outer dimension of the insulation base body 1 by 0.1 to 0.3 mm, and the outer side of the lid body 2 is 0.02 to 0.28 mm on the inner side of the outer side of the insulation base body 1 over the entire periphery of the insulation base body 1. Also, the glass sealing material 6 is composed by adding filler powder whose average grain diameter is 2.5 to 4μm and maximum grain diameter is 35μm or less to amorphous glass for 10 to 60 wt.% by external addition. <P>COPYRIGHT: (C)2003,JPO</p> |
