| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a semiconductor element (thin film transistor, a thin film diode, a photoelectric converter made of a PIN junction of a silicon or a silicon resistance element) which is thin in overall thickness and flexible (bendable) and has a light weight. <P>SOLUTION: The semiconductor device comprises a second adhesive material 16 of a coagulating material (an adhesive material as a representative) filled between a substrate (third substrate 17) and a layer (layer 13 to be released), including an element in a mold of a flat plate-like material like the substrate without forming the element on a plastic film, solidified, then the substrate (the third substrate 17) to the mold released, the layer (the layer 13 to be released) including the element only by the solidified adhesive material (second adhesive material 16) fixed and thinned in film, and lightened. <P>COPYRIGHT: (C)2003,JPO</p> |
