| 摘要 |
<P>PROBLEM TO BE SOLVED: To give evenness with high accuracy and a small surface roughness on both surfaces of a wafer, and to visually distinguish the front and rear surfaces of a wafer. <P>SOLUTION: An improved method for manufacturing a wafer contains a slice step 10 of slicing a single-crystal ingot to obtain a thin disk-like wafer; a chamfering step 11 for chamfering the wafer; a lapping step of a levelling the wafer; an etching step 13 for removing a process distortion on a surface of the wafer; a surface-polishing step 16 for mirror-polishing one surface of the wafer; and a cleaning step 17 for cleaning the wafer. With this characteristic constitution, the etching step contains a first etching step 13a of acid-etching the wafer and a second etching step 13b for alkali-etching the wafer, after the first etching step. A backlight polishing step 14 for polishing a part of unevenness on the back of the wafer, formed by the etching step, is included between the etching step and the surface mirror-polishing step. <P>COPYRIGHT: (C)2003,JPO |
