| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed circuit board by which production is possible without molding failures with satisfactory reliability, on the condition that the thickness of a prepreg layer is less than three times of the thickness of an inner copper film, even when steps having a thickness of 105μm or 175μm of an inner copper foil are filled in the inner copper foil circuit, in the multilayer printed circuit board formed by combining prepregs having different performance, and to provide the multilayer printed circuit board. SOLUTION: In the manufacturing method of the multilayer printed circuit board in which circuits are formed on one or more copper-clad plates and molded in one with a plurality of prepregs overlapped thereon, the prepregs are integrally molded into a multilayer by combining a prepreg including a resin impregnated thereto having the melt viscosity of 120 Pa.s or more at temperatures of 120-140°C with another prepreg including a resin having the melt viscosity of 80 Pa.s or less. COPYRIGHT: (C)2003,JPO |
